LM108D
vs
LM108AF
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA SEMICONDUCTOR PRODUCTS
|
SIGNETICS CORP
|
| Package Description |
DIP, DIP8,.3
|
,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
|
| Frequency Compensation |
NO
|
|
| Input Offset Voltage-Max |
3000 µV
|
1000 µV
|
| JESD-30 Code |
R-XDIP-T8
|
R-CDIP-T14
|
| JESD-609 Code |
e0
|
|
| Low-Offset |
NO
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
14
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Body Material |
CERAMIC
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP8,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
7
|
7
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
14
|
| Average Bias Current-Max (IIB) |
|
0.003 µA
|
| Common-mode Reject Ratio-Nom |
|
110 dB
|
| Neg Supply Voltage-Nom (Vsup) |
|
-15 V
|
| Supply Current-Max |
|
0.6 mA
|
| Supply Voltage-Nom (Vsup) |
|
15 V
|
|
|
|
Compare LM108AF with alternatives