LM124J vs LM124D883B feature comparison

LM124J Motorola Mobility LLC

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LM124D883B AMD

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC ADVANCED MICRO DEVICES INC
Part Package Code DIP DIE
Package Description DIP, DIP14,.3 DIE, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.15 µA
Common-mode Reject Ratio-Min 70 dB
Common-mode Reject Ratio-Nom 85 dB 85 dB
Frequency Compensation YES YES
Input Offset Voltage-Max 5000 µV
JESD-30 Code R-GDIP-T14 R-XUUC-N14
JESD-609 Code e0 e0
Length 19.495 mm
Low-Offset NO NO
Micropower YES YES
Neg Supply Voltage Limit-Max -16 V
Number of Functions 4 4
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED UNSPECIFIED
Package Code DIP DIE
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Current-Max 1.2 mA
Supply Voltage Limit-Max 16 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL UPPER
Voltage Gain-Min 50000
Width 7.62 mm
Base Number Matches 9 2
Screening Level MIL-STD-883 Class B
Slew Rate-Nom 0.06 V/us
Unity Gain BW-Nom 1000

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