LM13700AN vs LM13700N feature comparison

LM13700AN Rochester Electronics LLC

Buy Now Datasheet

LM13700N National Semiconductor Corporation

Buy Now Datasheet
Pbfree Code Yes
Rohs Code No No
Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description PLASTIC, DIP16 PLASTIC, DIP-16
Pin Count 16 16
Reach Compliance Code unknown not_compliant
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB) 7 µA 8 µA
Common-mode Reject Ratio-Nom 110 dB 110 dB
Input Offset Voltage-Max 2000 µV 4000 µV
JESD-30 Code R-PDIP-T16 R-PDIP-T16
JESD-609 Code e0 e0
Length 21.755 mm 21.755 mm
Moisture Sensitivity Level NOT SPECIFIED 1
Neg Supply Voltage Limit-Max -22 V -18 V
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Seated Height-Max 5.08 mm 5.08 mm
Slew Rate-Nom 50 V/us 50 V/us
Supply Voltage Limit-Max 22 V 18 V
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 40
Unity Gain BW-Nom 2000 2000
Width 7.62 mm 7.62 mm
Base Number Matches 3 2
ECCN Code EAR99
HTS Code 8542.33.00.01
Architecture TRANSCONDUCTANCE
Bias Current-Max (IIB) @25C 5 µA
Common-mode Reject Ratio-Min 80 dB
Frequency Compensation YES
Low-Offset NO
Package Equivalence Code DIP16,.3
Packing Method RAIL
Qualification Status Not Qualified

Compare LM13700AN with alternatives

Compare LM13700N with alternatives