LM2524DN
vs
SG3524CD-T
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NXP SEMICONDUCTORS
|
Package Description |
PLASTIC, DIP-16
|
SOP,
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Analog IC - Other Type |
SWITCHING CONTROLLER
|
SWITCHING CONTROLLER
|
Control Mode |
VOLTAGE-MODE
|
VOLTAGE-MODE
|
Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
Input Voltage-Max |
40 V
|
40 V
|
Input Voltage-Min |
8 V
|
7 V
|
Input Voltage-Nom |
20 V
|
20 V
|
JESD-30 Code |
R-PDIP-T16
|
R-PDSO-G16
|
JESD-609 Code |
e0
|
|
Length |
19.305 mm
|
10.3 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Output Current-Max |
0.2 A
|
0.25 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
SOP
|
Package Equivalence Code |
DIP16,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
5.08 mm
|
2.65 mm
|
Supply Current-Max (Isup) |
10 mA
|
|
Surface Mount |
NO
|
YES
|
Switcher Configuration |
PUSH-PULL
|
PUSH-PULL
|
Switching Frequency-Max |
550 kHz
|
550 kHz
|
Technology |
BIPOLAR
|
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
7.62 mm
|
7.5 mm
|
Base Number Matches |
2
|
1
|
Part Package Code |
|
SOIC
|
Pin Count |
|
16
|
|
|
|
Compare LM2524DN with alternatives
Compare SG3524CD-T with alternatives