LM308AN8#PBF
vs
LM208D
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
MOTOROLA INC
|
| Package Description |
DIP,
|
SOP, SOP8,.25
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.007 µA
|
0.002 µA
|
| Common-mode Reject Ratio-Min |
96 dB
|
85 dB
|
| Common-mode Reject Ratio-Nom |
110 dB
|
100 dB
|
| Input Offset Voltage-Max |
500 µV
|
3000 µV
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
e0
|
| Length |
9.78 mm
|
|
| Neg Supply Voltage Limit-Max |
-18 V
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-25 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP8,.3
|
SOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
250
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.445 mm
|
|
| Slew Rate-Nom |
0.1 V/us
|
|
| Supply Voltage Limit-Max |
18 V
|
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
OTHER
|
| Terminal Finish |
MATTE TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Voltage Gain-Min |
80000
|
25000
|
| Width |
7.62 mm
|
|
| Base Number Matches |
2
|
6
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Frequency Compensation |
|
NO
|
| Low-Offset |
|
NO
|
| Micropower |
|
YES
|
| Neg Supply Voltage-Nom (Vsup) |
|
-20 V
|
| Supply Current-Max |
|
0.4 mA
|
| Supply Voltage-Nom (Vsup) |
|
20 V
|
|
|
|
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