LM324ADBLE
vs
LMV324Q3MA/NOPB
feature comparison
| Pbfree Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SSOP, SSOP14,.25
|
SOIC-14
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Average Bias Current-Max (IIB) |
0.2 µA
|
0.5 µA
|
| Bias Current-Max (IIB) @25C |
0.25 µA
|
0.25 µA
|
| Common-mode Reject Ratio-Nom |
80 dB
|
65 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
5000 µV
|
7000 µV
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| Length |
6.2 mm
|
8.65 mm
|
| Low-Offset |
NO
|
NO
|
| Micropower |
YES
|
YES
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
SOP
|
| Package Equivalence Code |
SSOP14,.25
|
SOP14,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
2 mm
|
1.75 mm
|
| Slew Rate-Nom |
0.5 V/us
|
1 V/us
|
| Supply Current-Max |
3 mA
|
0.83 mA
|
| Supply Voltage Limit-Max |
32 V
|
5.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
BICMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
1200
|
1000
|
| Voltage Gain-Min |
15000
|
10000
|
| Width |
5.3 mm
|
3.91 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Common-mode Reject Ratio-Min |
|
50 dB
|
| Input Offset Current-Max (IIO) |
|
0.05 µA
|
| JESD-609 Code |
|
e3
|
| Low-Bias |
|
NO
|
| Moisture Sensitivity Level |
|
1
|
| Packing Method |
|
TUBE
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power |
|
NO
|
| Programmable Power |
|
NO
|
| Screening Level |
|
AEC-Q100
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Wideband |
|
NO
|
|
|
|
Compare LM324ADBLE with alternatives
Compare LMV324Q3MA/NOPB with alternatives