LM324N,602 vs LM324N feature comparison

LM324N,602 NXP Semiconductors

Buy Now Datasheet

LM324N STMicroelectronics

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS STMICROELECTRONICS
Part Package Code MO-001 DIP
Package Description DIP, ROHS COMPLIANT, PLASTIC, DIP-14
Pin Count 14 14
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB) 0.5 µA 0.3 µA
Common-mode Reject Ratio-Nom 70 dB 80 dB
Input Offset Voltage-Max 9000 µV 9000 µV
JESD-30 Code R-PDIP-T14 R-PDIP-T14
Length 19.025 mm 19.05 mm
Number of Functions 4 4
Number of Terminals 14 14
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm 5.33 mm
Slew Rate-Nom 0.3 V/us 0.4 V/us
Supply Voltage Limit-Max 32 V 32 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Unity Gain BW-Nom 1000 1300
Width 7.62 mm 7.62 mm
Base Number Matches 1 19
Rohs Code Yes
Samacsys Manufacturer STMicroelectronics
Architecture VOLTAGE-FEEDBACK
Bias Current-Max (IIB) @25C 0.15 µA
Frequency Compensation YES
JESD-609 Code e3
Low-Offset NO
Micropower YES
Package Equivalence Code DIP14,.3
Packing Method TUBE
Supply Current-Max 3 mA
Terminal Finish MATTE TIN
Voltage Gain-Min 25000

Compare LM324N,602 with alternatives

Compare LM324N with alternatives