LM324N,602 vs UPC324C-A feature comparison

LM324N,602 NXP Semiconductors

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UPC324C-A NEC Electronics Group

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NEC ELECTRONICS CORP
Part Package Code MO-001 DIP
Package Description DIP, DIP,
Pin Count 14 14
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB) 0.5 µA 0.25 µA
Common-mode Reject Ratio-Nom 70 dB 85 dB
Input Offset Voltage-Max 9000 µV 7000 µV
JESD-30 Code R-PDIP-T14 R-PDIP-T14
Length 19.025 mm
Number of Functions 4 4
Number of Terminals 14 14
Operating Temperature-Max 70 °C 80 °C
Operating Temperature-Min -20 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm 5.08 mm
Slew Rate-Nom 0.3 V/us
Supply Voltage Limit-Max 32 V 16 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL EXTENDED
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Unity Gain BW-Nom 1000
Width 7.62 mm 7.62 mm
Base Number Matches 1 2
JESD-609 Code e6
Neg Supply Voltage Limit-Max -16 V
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Finish TIN BISMUTH
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare LM324N,602 with alternatives

Compare UPC324C-A with alternatives