LM3702XCBPX-308
vs
LM3702XCBP-308
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
PLASTIC, SMD-9
|
PLASTIC, SMD-9
|
Pin Count |
9
|
9
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:N;WWD:N
|
BAT BUP SW:N;MNL RST:Y;OV DET:N;PW FL IP:N;PW FL IO:N;PW FL OP:N;PRG RST DLY:N;UV DET:N;WD:N;WWD:N
|
Adjustable Threshold |
NO
|
NO
|
Analog IC - Other Type |
VOLTAGE SUPERVISOR/RESET IC
|
VOLTAGE SUPERVISOR/RESET IC
|
JESD-30 Code |
S-PBGA-B9
|
S-PBGA-B9
|
Length |
1.412 mm
|
1.412 mm
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
9
|
9
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA9,3X3,20
|
BGA9,3X3,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Seated Height-Max |
0.85 mm
|
0.85 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1 V
|
1 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Threshold Voltage-Nom |
+3.08V
|
+3.08V
|
Width |
1.412 mm
|
1.412 mm
|
Base Number Matches |
2
|
2
|
Samacsys Manufacturer |
|
Texas Instruments
|
|
|
|