LM3900N vs LM3900N feature comparison

LM3900N Motorola Mobility LLC

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LM3900N Raytheon Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC RAYTHEON SEMICONDUCTOR
Part Package Code DIP
Package Description DIP, DIP-14
Pin Count 14
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB) 0.2 µA 0.2 µA
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e0 e0
Length 18.86 mm
Number of Functions 4 4
Number of Terminals 14 14
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.69 mm
Slew Rate-Nom 0.5 V/us
Supply Current-Max 14 mA 10 mA
Supply Voltage Limit-Max 32 V 32 V
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Unity Gain BW-Nom 4000 2500
Voltage Gain-Min 1200 1200
Width 7.62 mm
Base Number Matches 1 1
Architecture VOLTAGE-FEEDBACK
Bias Current-Max (IIB) @25C 0.2 µA
Frequency Compensation YES
Low-Offset NO
Package Equivalence Code DIP14,.3

Compare LM3900N with alternatives

Compare LM3900N with alternatives