LM393BIDGKR
vs
PLM393BIDR
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
TSSOP, TSSOP8,.19
|
HSOP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
2020-08-15
|
2019-09-26
|
| Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
| Amplifier Type |
COMPARATOR
|
COMPARATOR
|
| Average Bias Current-Max (IIB) |
0.025 µA
|
0.05 µA
|
| Bias Current-Max (IIB) @25C |
0.025 µA
|
|
| Input Offset Voltage-Max |
2500 µV
|
4000 µV
|
| JESD-30 Code |
S-PDSO-G8
|
R-PDSO-G8
|
| JESD-609 Code |
e4
|
|
| Length |
3 mm
|
4.905 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Type |
OPEN-COLLECTOR; OPEN-DRAIN
|
OPEN-COLLECTOR
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
HSOP
|
| Package Equivalence Code |
TSSOP8,.19
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Response Time-Nom |
1000 ns
|
1000 ns
|
| Seated Height-Max |
1.1 mm
|
1.75 mm
|
| Supply Current-Max |
0.8 mA
|
|
| Supply Voltage Limit-Max |
38 V
|
38 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
3 mm
|
3.895 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare LM393BIDGKR with alternatives
Compare PLM393BIDR with alternatives