LM3S1150-EQC50-A2 vs LM3S1150-IBZ50-A2T feature comparison

LM3S1150-EQC50-A2 Texas Instruments

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LM3S1150-IBZ50-A2T Texas Instruments

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code QFP BGA
Package Description LFQFP, QFP100,.63SQ,20 BGA-108
Pin Count 100 108
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer Texas Instruments
Has ADC YES YES
Address Bus Width
Bit Size 32 32
Clock Frequency-Max 0.032 MHz 0.032 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code S-PQFP-G100 S-PBGA-B108
Length 14 mm 10 mm
Number of I/O Lines 52 52
Number of Terminals 100 108
On Chip Program ROM Width 8 8
Operating Temperature-Max 105 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP LFBGA
Package Equivalence Code QFP100,.63SQ,20 BGA108,12X12,32
Package Shape SQUARE SQUARE
Package Style FLATPACK GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 16384 16384
ROM (words) 65536 65536
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 1.5 mm
Speed 50 MHz 50 MHz
Supply Voltage-Max 2.75 V 2.75 V
Supply Voltage-Min 2.5 V 2.5 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 0.8 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 14 mm 10 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 2 1
JESD-609 Code e1
Moisture Sensitivity Level 3
Terminal Finish TIN SILVER COPPER

Compare LM3S1150-EQC50-A2 with alternatives

Compare LM3S1150-IBZ50-A2T with alternatives