LM3S1N11-IBZ50-C1 vs LM3S1N11-IBZ50-C1T feature comparison

LM3S1N11-IBZ50-C1 Texas Instruments

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LM3S1N11-IBZ50-C1T Texas Instruments

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code BGA BGA
Package Description LFBGA, BGA108,12X12,32 LFBGA, BGA108,12X12,32
Pin Count 108 108
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Address Bus Width
Bit Size 32 32
Boundary Scan NO NO
Clock Frequency-Max 0.032 MHz 0.032 MHz
DAC Channels NO NO
DMA Channels YES YES
External Data Bus Width
JESD-30 Code S-PBGA-B108 S-PBGA-B108
Length 10 mm 10 mm
Number of I/O Lines 67 67
Number of Terminals 108 108
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA LFBGA
Package Equivalence Code BGA108,12X12,32 BGA108,12X12,32
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
RAM (bytes) 12288 12288
ROM (words) 65536 65536
ROM Programmability FLASH FLASH
Seated Height-Max 1.5 mm 1.5 mm
Speed 50 MHz 50 MHz
Supply Voltage-Max 1.32 V 1.32 V
Supply Voltage-Min 1.2 V 1.2 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 10 mm 10 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 1

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