LM4879IBLX/NOPB
vs
TPA122D
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
TEXAS INSTRUMENTS INC
|
| Package Description |
TFBGA, BGA9,3X3,20
|
SOIC-8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Bandwidth-Nom |
20 kHz
|
20 kHz
|
| Consumer IC Type |
AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
| Harmonic Distortion |
1%
|
0.1%
|
| JESD-30 Code |
S-PBGA-B9
|
R-PDSO-G8
|
| Length |
1.514 mm
|
4.9 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
9
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Power-Nom |
1.1 W
|
0.15 W
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
SOP
|
| Package Equivalence Code |
BGA9,3X3,20
|
SOP8,.25
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.045 mm
|
1.75 mm
|
| Supply Current-Max |
10 mA
|
3 mA
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.2 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
| Width |
1.514 mm
|
3.9 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
8
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| JESD-609 Code |
|
e4
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
|
|
|
Compare LM4879IBLX/NOPB with alternatives
Compare TPA122D with alternatives