LM75BIMM-5+
vs
LM75AD,118
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Not Recommended
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
NXP SEMICONDUCTORS
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Accuracy-Max (Cel) |
3 Cel
|
3 Cel
|
Body Breadth |
3 mm
|
3.9 mm
|
Body Height |
1.1 mm
|
1.75 mm
|
Body Length or Diameter |
3 mm
|
4.9 mm
|
JESD-609 Code |
e3
|
|
Mounting Feature |
SURFACE MOUNT
|
SURFACE MOUNT
|
Number of Bits |
9
|
11
|
Number of Terminals |
8
|
8
|
Operating Current-Max |
0.006 mA
|
1 mA
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Output Interface Type |
2-WIRE INTERFACE
|
2-WIRE INTERFACE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Equivalence Code |
TSSOP8,.19
|
SOP8,.25
|
Package Shape/Style |
SQUARE
|
RECTANGULAR
|
Sensors/Transducers Type |
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
|
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
3 V
|
2.8 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
|
Terminal Finish |
MATTE TIN
|
|
Termination Type |
SOLDER
|
SOLDER
|
Base Number Matches |
2
|
1
|
Part Package Code |
|
SOIC
|
Package Description |
|
3.9 MM, MS-012, PLASTIC, SO-8
|
Pin Count |
|
8
|
Manufacturer Package Code |
|
SOT96-1
|
Factory Lead Time |
|
16 Weeks
|
Samacsys Manufacturer |
|
NXP
|
Additional Feature |
|
THERMAL WATCHDOG
|
Housing |
|
PLASTIC
|
|
|
|
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