LM961
vs
BM77SPP03MC2-000AAA
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Contact Manufacturer
|
Obsolete
|
Ihs Manufacturer |
LM TECHNOLOGIES LTD
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
,
|
MODULE-30
|
Reach Compliance Code |
unknown
|
compliant
|
JESD-30 Code |
R-XXMA-N29
|
R-XXMA-N30
|
Length |
18.9 mm
|
15 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
29
|
30
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
-20 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Seated Height-Max |
2.55 mm
|
1.86 mm
|
Supply Voltage-Nom |
5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
TELECOM CIRCUIT
|
TELECOM CIRCUIT
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
1.27 mm
|
1.1 mm
|
Terminal Position |
UNSPECIFIED
|
UNSPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
12.71 mm
|
12 mm
|
Base Number Matches |
1
|
1
|
HTS Code |
|
8542.39.00.01
|
Data Rate |
|
112 Mbps
|
Package Code |
|
XMA
|
Package Equivalence Code |
|
MODULE,30LEAD(UNSPEC)
|
|
|
|
Compare LM961 with alternatives
Compare BM77SPP03MC2-000AAA with alternatives