LMC6032MWA
vs
LM158H/NOPB
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
WAFER
|
BCY
|
| Package Description |
DIE, WAFER
|
METAL CAN, TO-5, 8 PIN
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Architecture |
VOLTAGE-FEEDBACK
|
VOLTAGE-FEEDBACK
|
| Common-mode Reject Ratio-Nom |
83 dB
|
85 dB
|
| Frequency Compensation |
YES
|
YES
|
| Input Offset Voltage-Max |
9000 µV
|
7000 µV
|
| JESD-30 Code |
X-XUUC-N
|
O-MBCY-W8
|
| Low-Bias |
YES
|
|
| Low-Offset |
NO
|
NO
|
| Micropower |
YES
|
|
| Neg Supply Voltage Limit-Max |
|
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Number of Functions |
2
|
2
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
UNSPECIFIED
|
METAL
|
| Package Code |
DIE
|
TO-5
|
| Package Equivalence Code |
WAFER
|
CAN8,.2
|
| Package Shape |
UNSPECIFIED
|
ROUND
|
| Package Style |
UNCASED CHIP
|
CYLINDRICAL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Slew Rate-Min |
0.4 V/us
|
|
| Slew Rate-Nom |
1.1 V/us
|
0.5 V/us
|
| Supply Current-Max |
1.9 mA
|
2 mA
|
| Supply Voltage Limit-Max |
16 V
|
32 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
BIPOLAR
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
NO LEAD
|
WIRE
|
| Terminal Position |
UPPER
|
BOTTOM
|
| Unity Gain BW-Nom |
1400
|
1000
|
| Voltage Gain-Min |
20000
|
50000
|
| Base Number Matches |
2
|
2
|
| Rohs Code |
|
Yes
|
| Pin Count |
|
8
|
| Average Bias Current-Max (IIB) |
|
0.03 µA
|
| Bias Current-Max (IIB) @25C |
|
0.05 µA
|
| Common-mode Reject Ratio-Min |
|
70 dB
|
| JESD-609 Code |
|
e1
|
| Moisture Sensitivity Level |
|
1
|
| Number of Terminals |
|
8
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare LMC6032MWA with alternatives
Compare LM158H/NOPB with alternatives