LMC8101BP vs LMC8101TP/NOPB feature comparison

LMC8101BP Rochester Electronics LLC

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LMC8101TP/NOPB National Semiconductor Corporation

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Pbfree Code Yes
Rohs Code No Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NATIONAL SEMICONDUCTOR CORP
Part Package Code BGA
Package Description MICRO, SMD-8
Pin Count 8
Reach Compliance Code unknown compliant
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB) 0.000064 µA
Common-mode Reject Ratio-Nom 87 dB
Input Offset Voltage-Max 7000 µV 7000 µV
JESD-30 Code S-PBGA-B8 S-PBGA-B8
JESD-609 Code e0 e1
Length 1.412 mm
Moisture Sensitivity Level 1 1
Neg Supply Voltage Limit-Max -6 V
Neg Supply Voltage-Nom (Vsup) -5 V
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA FBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Slew Rate-Nom 1.2 V/us
Supply Voltage Limit-Max 6 V 6 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Unity Gain BW-Nom 840
Width 1.412 mm
Base Number Matches 3 2
Architecture VOLTAGE-FEEDBACK
Frequency Compensation YES
Low-Bias YES
Low-Offset NO
Micropower NO
Package Equivalence Code BGA8,3X3,20
Packing Method TAPE AND REEL
Power NO
Programmable Power NO
Qualification Status Not Qualified
Slew Rate-Min 0.8 V/us
Supply Current-Max 1.9 mA
Voltage Gain-Min 560
Wideband NO

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