LMC8101BP vs LMC8101TPX feature comparison

LMC8101BP National Semiconductor Corporation

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LMC8101TPX Texas Instruments

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP TEXAS INSTRUMENTS INC
Package Description MICRO, SMD-8 LEAD FREE, MICRO, SMD-8
Reach Compliance Code not_compliant compliant
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.000064 µA 0.000064 µA
Common-mode Reject Ratio-Nom 87 dB 87 dB
Frequency Compensation YES
Input Offset Voltage-Max 7000 µV 7000 µV
JESD-30 Code S-PBGA-B8 S-PBGA-B8
JESD-609 Code e0
Length 1.412 mm 1.412 mm
Low-Bias YES
Low-Offset NO
Micropower NO
Moisture Sensitivity Level 1 1
Neg Supply Voltage Limit-Max -6 V -6 V
Neg Supply Voltage-Nom (Vsup) -5 V -5 V
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code FBGA FBGA
Package Equivalence Code BGA8,3X3,20
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH
Packing Method TAPE AND REEL
Peak Reflow Temperature (Cel) 260
Power NO
Programmable Power NO
Qualification Status Not Qualified Not Qualified
Slew Rate-Min 0.8 V/us
Slew Rate-Nom 1.2 V/us 1.2 V/us
Supply Current-Max 1.9 mA
Supply Voltage Limit-Max 6 V 6 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn63Pb37)
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Unity Gain BW-Nom 840 840
Voltage Gain-Min 560
Wideband NO
Width 1.412 mm 1.412 mm
Base Number Matches 3 2
Pbfree Code No
Part Package Code BGA
Pin Count 8
ECCN Code EAR99
HTS Code 8542.33.00.01

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