LMH6559MF vs CLC114AJ-MLS feature comparison

LMH6559MF National Semiconductor Corporation

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CLC114AJ-MLS Texas Instruments

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Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Part Package Code SOT-23
Package Description SOT-23, 5 PIN DIP, DIP14,.3
Pin Count 5
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.33.00.01
Amplifier Type BUFFER BUFFER
Average Bias Current-Max (IIB) 14 µA 10 µA
Bandwidth (3dB)-Nom 1050 MHz 200 MHz
Input Offset Voltage-Max 25000 µV 8200 µV
JESD-30 Code R-PDSO-G5 R-GDIP-T14
JESD-609 Code e0 e0
Length 2.92 mm 19.43 mm
Moisture Sensitivity Level 1
Neg Supply Voltage Limit-Max -6.5 V -7 V
Neg Supply Voltage-Nom (Vsup) -5 V -5 V
Number of Functions 1 4
Number of Terminals 5 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Current-Min 0.05 A 0.025 A
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code LSSOP DIP
Package Equivalence Code TSOP5/6,.11,37 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.22 mm 5.08 mm
Slew Rate-Nom 4580 V/us 450 V/us
Supply Current-Max 17 mA 17 mA
Supply Voltage Limit-Max 6.5 V 7 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology BIPOLAR BIPOLAR
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.95 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 1.6 mm 7.62 mm
Base Number Matches 3 3
Bias Current-Max (IIB) @25C 5 µA
Screening Level MIL-STD-883
Slew Rate-Min 180 V/us

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