LMH6624MA vs CLC5802IM feature comparison

LMH6624MA National Semiconductor Corporation

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CLC5802IM Rochester Electronics LLC

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Rohs Code No No
Part Life Cycle Code Transferred Active
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP ROCHESTER ELECTRONICS LLC
Part Package Code SOIC SOIC
Package Description SOIC-8 SOIC-8
Pin Count 8 8
Reach Compliance Code not_compliant unknown
ECCN Code EAR99
HTS Code 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 20 µA 65 µA
Bias Current-Max (IIB) @25C 20 µA
Common-mode Reject Ratio-Nom 90 dB 60 dB
Frequency Compensation YES
Input Offset Voltage-Max 750 µV 3500 µV
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e0 e0
Length 4.902 mm 4.9 mm
Low-Offset YES
Moisture Sensitivity Level 1 NOT SPECIFIED
Neg Supply Voltage Limit-Max -6.6 V -7 V
Neg Supply Voltage-Nom (Vsup) -2.5 V -5 V
Number of Functions 1 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method RAIL
Peak Reflow Temperature (Cel) 235 NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.753 mm 1.75 mm
Slew Rate-Nom 300 V/us 450 V/us
Supply Current-Max 18 mA
Supply Voltage Limit-Max 6.6 V 7 V
Supply Voltage-Nom (Vsup) 2.5 V 5 V
Surface Mount YES YES
Technology BIPOLAR
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Voltage Gain-Min 3160
Wideband YES
Width 3.899 mm 3.9 mm
Base Number Matches 2 3
Pbfree Code No
Unity Gain BW-Nom 120000

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