LMX2306SLBX/NOPB
vs
LMX2306TM
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
QFN
|
|
| Package Description |
QCCN,
|
0.173 INCH, PLASTIC, TSSOP-16
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
|
| Additional Feature |
DUAL MODULUS PRESCALER: 8/9
|
DUAL MODULUS PRESCALER: 8/9
|
| Analog IC - Other Type |
PLL FREQUENCY SYNTHESIZER
|
PLL FREQUENCY SYNTHESIZER
|
| JESD-30 Code |
S-CQCC-N16
|
R-PDSO-G16
|
| JESD-609 Code |
e4
|
e0
|
| Length |
3.5 mm
|
5 mm
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
QCCN
|
TSSOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL GOLD
|
Tin/Lead (Sn85Pb15)
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
| Width |
3.5 mm
|
4.4 mm
|
| Base Number Matches |
1
|
2
|
| Package Equivalence Code |
|
TSSOP16,.25
|
|
|
|
Compare LMX2306SLBX/NOPB with alternatives
Compare LMX2306TM with alternatives