LP5952TLX-1.2/NOPB
vs
LP5952TLX-1.2
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
NATIONAL SEMICONDUCTOR CORP
|
Package Description |
LEAD FREE, SMD, 5 PIN
|
LEAD FREE, SMD, 5 PIN
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Adjustability |
FIXED
|
FIXED
|
Dropout Voltage1-Nom |
0.088 V
|
0.088 V
|
Input Voltage Absolute-Max |
6 V
|
6 V
|
Input Voltage-Max |
4.5 V
|
4.5 V
|
Input Voltage-Min |
0.7 V
|
0.7 V
|
JESD-30 Code |
R-PBGA-B5
|
R-PBGA-B5
|
JESD-609 Code |
e1
|
e0
|
Length |
1.335 mm
|
1.335 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Outputs |
1
|
1
|
Number of Terminals |
5
|
5
|
Operating Temperature TJ-Max |
125 °C
|
125 °C
|
Operating Temperature TJ-Min |
-40 °C
|
-40 °C
|
Output Current1-Max |
0.35 A
|
0.35 A
|
Output Voltage1-Max |
1.224 V
|
1.224 V
|
Output Voltage1-Min |
1.176 V
|
1.176 V
|
Output Voltage1-Nom |
1.2 V
|
1.2 V
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA5,3X3,17/10
|
BGA5,3X3,17/10
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Packing Method |
TR
|
TR
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Regulator Type |
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT STANDARD REGULATOR
|
Seated Height-Max |
0.675 mm
|
0.675 mm
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
40
|
Voltage Tolerance-Max |
2%
|
2%
|
Width |
0.955 mm
|
0.955 mm
|
Base Number Matches |
1
|
2
|
|
|
|