LP87C52-24 vs SST89V58RD2-33-I-PI feature comparison

LP87C52-24 Intel Corporation

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SST89V58RD2-33-I-PI Silicon Storage Technology

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP SILICON STORAGE TECHNOLOGY INC
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 40 40
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width 16 16
Bit Size 8 8
Clock Frequency-Max 24 MHz 33 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 8 8
JESD-30 Code R-PDIP-T40 R-PDIP-T40
Length 52.26 mm 51.943 mm
Number of I/O Lines 32 32
Number of Terminals 40 40
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels NO YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
ROM Programmability OTPROM FLASH
Seated Height-Max 5.08 mm 5.588 mm
Speed 24 MHz 33 MHz
Supply Current-Max 56 mA
Supply Voltage-Max 6 V 3.6 V
Supply Voltage-Min 4 V 2.7 V
Supply Voltage-Nom 5 V 3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1
Rohs Code No
ECCN Code 3A991.A.2
Peak Reflow Temperature (Cel) 240

Compare LP87C52-24 with alternatives

Compare SST89V58RD2-33-I-PI with alternatives