LPC1778FBD144 vs 935283234551 feature comparison

LPC1778FBD144 NXP Semiconductors

Buy Now Datasheet

935283234551 NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Active Not Recommended
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code QFP
Package Description 20 X 20 MM, 1.40 MM HEIGHT, PLASTIC, MS-026, SOT486-1, LQFP-144 TFBGA,
Pin Count 144
Reach Compliance Code compliant unknown
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 2 Days
Samacsys Manufacturer NXP
Has ADC YES YES
Address Bus Width 16 24
Bit Size 32 32
Clock Frequency-Max 25 MHz 25 MHz
DAC Channels YES YES
DMA Channels YES YES
External Data Bus Width 8 32
JESD-30 Code S-PQFP-G144 S-PBGA-B208
JESD-609 Code e3 e1
Length 20 mm 15 mm
Moisture Sensitivity Level 2
Number of I/O Lines 119 160
Number of Terminals 144 208
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP TFBGA
Package Equivalence Code QFP144,.87SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RAM (bytes) 98304
ROM (words) 524288
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 1.2 mm
Speed 120 MHz 72 MHz
Supply Current-Max 100 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3.3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN TIN SILVER COPPER
Terminal Form GULL WING BALL
Terminal Pitch 0.5 mm 0.8 mm
Terminal Position QUAD BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 20 mm 15 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1

Compare LPC1778FBD144 with alternatives

Compare 935283234551 with alternatives