LPC1778FET208
vs
LPC1788FET208,551
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
15 X 15 MM, 0.70 MM HEIGHT, PLASTIC, SOT950-1, TFBGA-208
|
15 X 15 MM, 0.70 MM HEIGHT, PLASTIC, SOT950-1, TFBGA-208
|
| Pin Count |
208
|
208
|
| Manufacturer Package Code |
SOT-950-1
|
SOT950-1
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
26
|
26
|
| Bit Size |
32
|
32
|
| Clock Frequency-Max |
25 MHz
|
25 MHz
|
| DAC Channels |
YES
|
YES
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
32
|
32
|
| JESD-30 Code |
S-PBGA-B208
|
S-PBGA-B208
|
| JESD-609 Code |
e1
|
e1
|
| Length |
15 mm
|
15 mm
|
| Moisture Sensitivity Level |
2
|
2
|
| Number of I/O Lines |
165
|
165
|
| Number of Terminals |
208
|
208
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
TFBGA
|
| Package Equivalence Code |
BGA208,17X17,32
|
BGA208,17X17,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
98304
|
98304
|
| ROM (words) |
524288
|
524288
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Speed |
120 MHz
|
120 MHz
|
| Supply Current-Max |
100 mA
|
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3.3 V
|
3.3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN SILVER COPPER
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
15 mm
|
15 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
2
|
1
|
| Factory Lead Time |
|
13 Weeks
|
| Samacsys Manufacturer |
|
NXP
|
| CPU Family |
|
CORTEX-M3
|
|
|
|
Compare LPC1778FET208 with alternatives
Compare LPC1788FET208,551 with alternatives