LPC1785FBD208 vs LPC1786FBD208 feature comparison

LPC1785FBD208 NXP Semiconductors

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LPC1786FBD208 NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code QFP QFP
Package Description LFQFP, QFP208,1.2SQ,20 LFQFP, QFP208,1.2SQ,20
Pin Count 208 208
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Address Bus Width 26 26
Bit Size 32 32
Clock Frequency-Max 25 MHz 25 MHz
DAC Channels YES YES
DMA Channels YES YES
External Data Bus Width 32 32
JESD-30 Code S-PQFP-G208 S-PQFP-G208
JESD-609 Code e3 e3
Length 28 mm 28 mm
Moisture Sensitivity Level 2 2
Number of I/O Lines 165 165
Number of Terminals 208 208
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP LFQFP
Package Equivalence Code QFP208,1.2SQ,20 QFP208,1.2SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 81920 81920
ROM (words) 262144 262144
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm 1.6 mm
Speed 120 MHz 120 MHz
Supply Current-Max 100 mA 100 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3.3 V 3.3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 28 mm 28 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 1

Compare LPC1785FBD208 with alternatives

Compare LPC1786FBD208 with alternatives