LPC2468FET208
vs
LPC2468FET208,551
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Not Recommended
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
BGA
|
BGA
|
Pin Count |
208
|
208
|
Manufacturer Package Code |
SOT-950-1
|
SOT950-1
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Samacsys Manufacturer |
NXP
|
NXP
|
Has ADC |
YES
|
YES
|
Address Bus Width |
24
|
24
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
YES
|
CPU Family |
ARM7
|
ARM7
|
Clock Frequency-Max |
25 MHz
|
25 MHz
|
DAC Channels |
YES
|
YES
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
32
|
32
|
Format |
FIXED POINT
|
FIXED POINT
|
Integrated Cache |
NO
|
NO
|
JESD-30 Code |
S-PBGA-B208
|
S-PBGA-B208
|
JESD-609 Code |
e1
|
e1
|
Length |
15 mm
|
15 mm
|
Low Power Mode |
YES
|
YES
|
Moisture Sensitivity Level |
2
|
2
|
Number of DMA Channels |
1
|
1
|
Number of External Interrupts |
4
|
4
|
Number of I/O Lines |
160
|
160
|
Number of Serial I/Os |
4
|
4
|
Number of Terminals |
208
|
208
|
Number of Timers |
4
|
4
|
On Chip Data RAM Width |
32
|
32
|
On Chip Program ROM Width |
128
|
128
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
TFBGA
|
Package Equivalence Code |
BGA208,17X17,32
|
BGA208,17X17,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
65536
|
65536
|
RAM (words) |
16384
|
16384
|
ROM (words) |
32768
|
32768
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Speed |
72 MHz
|
72 MHz
|
Supply Current-Max |
100 mA
|
100 mA
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3.3 V
|
3.3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
15 mm
|
15 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
1
|
Package Description |
|
TFBGA-208
|
|
|
|
Compare LPC2468FET208 with alternatives
Compare LPC2468FET208,551 with alternatives