LPC4357FET256,551 vs LPC4357JET256 feature comparison

LPC4357FET256,551 NXP Semiconductors

Buy Now Datasheet

LPC4357JET256 NXP Semiconductors

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code BGA
Package Description 17 X 17 MM, 1 MM HEIGHT, PLASTIC, SOT740-2, MO-192, LBGA-256 17 X 17 MM, 1 MM HEIGHT, PLASTIC, SOT740-2, MO-192, LBGA-256
Pin Count 256
Manufacturer Package Code SOT740-2
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer NXP
Has ADC YES YES
Address Bus Width 24
Bit Size 32 32
CPU Family CORTEX-M4
Clock Frequency-Max 25 MHz 25 MHz
DAC Channels YES YES
DMA Channels YES YES
External Data Bus Width 32
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e1
Length 17 mm 17 mm
Moisture Sensitivity Level 3 3
Number of I/O Lines 164 164
Number of Terminals 256 256
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified
RAM (bytes) 139264
ROM (words) 1048576
ROM Programmability FLASH FLASH
Seated Height-Max 1.55 mm 1.55 mm
Speed 204 MHz 204 MHz
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3.3 V 2.2 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 17 mm 17 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 1 2

Compare LPC4357FET256,551 with alternatives

Compare LPC4357JET256 with alternatives