LSI53C1010R
vs
LSI53C1010R
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
BROADCOM INC
|
AVAGO TECHNOLOGIES INC
|
| Package Description |
35 X 35 MM, 1.27 MM PITCH, PLASTIC, MO-151, EPBGA-456
|
BGA, BGA456,26X26,50
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
64
|
64
|
| Bus Compatibility |
PCI
|
PCI
|
| Clock Frequency-Max |
40 MHz
|
40 MHz
|
| Data Transfer Rate-Max |
320 MBps
|
320 MBps
|
| Drive Interface Standard |
IEEE 1149.1
|
IEEE 1149.1
|
| External Data Bus Width |
64
|
64
|
| JESD-30 Code |
S-PBGA-B456
|
S-PBGA-B456
|
| JESD-609 Code |
e0
|
e0
|
| Length |
35 mm
|
35 mm
|
| Number of Terminals |
456
|
456
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA456,26X26,50
|
BGA456,26X26,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Peak Reflow Temperature (Cel) |
225
|
225
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.5 mm
|
2.5 mm
|
| Supply Current-Max |
800 mA
|
800 mA
|
| Supply Voltage-Max |
3.47 V
|
3.47 V
|
| Supply Voltage-Min |
3.13 V
|
3.13 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
35 mm
|
35 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, SCSI
|
BUS CONTROLLER, SCSI
|
| Base Number Matches |
1
|
1
|
|
|
|