LSI53C875JB
vs
LSI53C875JE
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
LSI CORP
|
LSI CORP
|
| Part Package Code |
BGA
|
QFP
|
| Package Description |
BGA,
|
QFP,
|
| Pin Count |
169
|
160
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Bus Compatibility |
PCI
|
PCI
|
| Clock Frequency-Max |
80 MHz
|
80 MHz
|
| Data Transfer Rate-Max |
40 MBps
|
40 MBps
|
| External Data Bus Width |
32
|
32
|
| JESD-30 Code |
S-PBGA-B169
|
S-PQFP-G160
|
| JESD-609 Code |
e0
|
e0
|
| Length |
23 mm
|
28 mm
|
| Number of Terminals |
169
|
160
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
QFP
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.4 mm
|
4.01 mm
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
1.5 mm
|
0.65 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
23 mm
|
28 mm
|
| uPs/uCs/Peripheral ICs Type |
BUS CONTROLLER, SCSI
|
BUS CONTROLLER, SCSI
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare LSI53C875JB with alternatives
Compare LSI53C875JE with alternatives