LSM330DLC
vs
LSM330D
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Part Package Code |
LGA
|
|
| Package Description |
4 X 5 Mm, 1.10 Mm Height, Green, Plastic, Lga-28
|
5.50 X 3 Mm, 1 Mm Height, Green, Plastic, Lga-28
|
| Pin Count |
28
|
|
| Reach Compliance Code |
Compliant
|
Unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
Analog Circuit
|
Analog Circuit
|
| JESD-30 Code |
R-XBGA-B28
|
R-PBGA-B28
|
| JESD-609 Code |
e4
|
|
| Length |
5 Mm
|
5.5 Mm
|
| Moisture Sensitivity Level |
3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
Unspecified
|
Plastic/Epoxy
|
| Package Code |
TFLGA
|
VFLGA
|
| Package Equivalence Code |
LCC28,.16X.2,20
|
|
| Package Shape |
Rectangular
|
Rectangular
|
| Package Style |
Grid Array, Thin Profile, Fine Pitch
|
Grid Array, Very Thin Profile, Fine Pitch
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.1 Mm
|
1 Mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.4 V
|
2.4 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
Yes
|
Yes
|
| Technology |
Cmos
|
Cmos
|
| Temperature Grade |
Industrial
|
Industrial
|
| Terminal Finish |
Nickel Gold
|
|
| Terminal Form |
Butt
|
Butt
|
| Terminal Pitch |
0.5 Mm
|
0.45 Mm
|
| Terminal Position |
Bottom
|
Bottom
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
4 Mm
|
3 Mm
|
| Base Number Matches |
1
|
1
|
|
|
|