LSM6DS0
vs
LSM330D
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
Package Description |
3 X 3 MM, 0.86 MM HEIGHT, GREEN, PLASTIC, LGA-16
|
VFLGA,
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
STMicroelectronics
|
STMicroelectronics
|
Analog IC - Other Type |
ANALOG CIRCUIT
|
ANALOG CIRCUIT
|
JESD-30 Code |
S-PBGA-B16
|
R-PBGA-B28
|
Length |
3 mm
|
5.5 mm
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
28
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFLGA
|
VFLGA
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Seated Height-Max |
0.86 mm
|
1 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
1.71 V
|
2.4 V
|
Supply Voltage-Nom (Vsup) |
2.2 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BUTT
|
BUTT
|
Terminal Pitch |
0.5 mm
|
0.45 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
3 mm
|
3 mm
|
Base Number Matches |
2
|
6
|
|
|
|
Compare LSM6DS0 with alternatives
Compare LSM330D with alternatives