LTC3130EUDC#TRPBF
vs
LM5001SDE
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
LINEAR TECHNOLOGY CORP
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
QFN
|
SOIC
|
| Package Description |
QFN-20
|
HVSON,
|
| Pin Count |
20
|
8
|
| Manufacturer Package Code |
UDC
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| Date Of Intro |
2016-08-04
|
|
| Additional Feature |
ADJ OUTPUT VOLTAGE= 1V TO 25V
|
|
| Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
| Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
25 V
|
75 V
|
| Input Voltage-Min |
0.6 V
|
3.1 V
|
| Input Voltage-Nom |
12 V
|
10 V
|
| JESD-30 Code |
R-PQCC-N20
|
S-PDSO-N8
|
| Length |
4 mm
|
4 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current-Max |
1.15 A
|
1.2 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
HVSON
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
BUCK-BOOST
|
BOOST
|
| Switching Frequency-Max |
1400 kHz
|
900 kHz
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
3 mm
|
4 mm
|
| Base Number Matches |
2
|
2
|
| Pbfree Code |
|
No
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.39.00.01
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
1
|
| Output Voltage-Nom |
|
6.85 V
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
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