LTC6409HUDB#TRPBF
vs
LTC6409CUDB#PBF
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ANALOG DEVICES INC
|
LINEAR TECHNOLOGY CORP
|
| Package Description |
3 X 2 MM, 0.75 MM HEIGHT, LEAD FREE, PLASTIC, QFN-10
|
|
| Pin Count |
10
|
10
|
| Manufacturer Package Code |
05-08-1848
|
UDB
|
| Reach Compliance Code |
compliant
|
compliant
|
| Samacsys Manufacturer |
Analog Devices
|
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
160 µA
|
|
| Input Offset Voltage-Max |
1400 µV
|
|
| JESD-30 Code |
R-PQCC-N10
|
R-PQCC-N10
|
| JESD-609 Code |
e3
|
e3
|
| Length |
3 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
10
|
10
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VQCCN
|
QCCN
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
CHIP CARRIER
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.85 mm
|
|
| Slew Rate-Nom |
1720 V/us
|
|
| Supply Voltage Limit-Max |
5.5 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
COMMERCIAL
|
| Terminal Finish |
Matte Tin (Sn) - annealed
|
Matte Tin (Sn)
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Unity Gain BW-Nom |
8000000
|
|
| Width |
2 mm
|
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
QFN
|
| Package Equivalence Code |
|
LCC10,.08X.12,31/20
|
| Supply Current-Max |
|
58 mA
|
|
|
|
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