LTC6994CS6-2#TRMPBF
vs
LTC6994IS6-2#TRM
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
LINEAR TECHNOLOGY CORP
|
LINEAR TECHNOLOGY CORP
|
| Part Package Code |
SOT
|
SOT
|
| Package Description |
1 MM HEIGHT, LEAD FREE, PLASTIC, MO-193, TSOT-23, 6 PIN
|
|
| Pin Count |
6
|
6
|
| Manufacturer Package Code |
S6
|
S6
|
| Reach Compliance Code |
compliant
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
6994
|
|
| JESD-30 Code |
R-PDSO-G6
|
R-PDSO-G6
|
| JESD-609 Code |
e3
|
e0
|
| Length |
2.9 mm
|
|
| Logic IC Type |
SILICON DELAY LINE
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Taps/Steps |
1
|
1
|
| Number of Terminals |
6
|
6
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Polarity |
TRUE
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSSOP
|
TSOP
|
| Package Equivalence Code |
TSOP6,.11,37
|
TSOP6,.11,37
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Power Supply Current-Max (ICC) |
0.2 mA
|
0.2 mA
|
| Programmable Delay Line |
YES
|
YES
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
2.25 V
|
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.95 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
1.625 mm
|
|
| Base Number Matches |
2
|
2
|
| Packing Method |
|
TR
|
|
|
|
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