LUPXA255A0C400
vs
MPC850SRZT50A
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
INTEL CORP
|
MOTOROLA INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
BGA, BGA256,16X16,40
|
BGA,
|
Pin Count |
256
|
256
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Address Bus Width |
26
|
|
Bit Size |
32
|
|
Boundary Scan |
YES
|
|
Clock Frequency-Max |
3.6864 MHz
|
|
External Data Bus Width |
32
|
|
Format |
FIXED POINT
|
|
Integrated Cache |
YES
|
|
JESD-30 Code |
S-PBGA-B256
|
R-PBGA-B256
|
JESD-609 Code |
e1
|
|
Length |
17 mm
|
|
Low Power Mode |
YES
|
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
BGA
|
BGA
|
Package Equivalence Code |
BGA256,16X16,40
|
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
250
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2 mm
|
|
Speed |
400 MHz
|
|
Supply Voltage-Max |
1.43 V
|
|
Supply Voltage-Min |
1.235 V
|
|
Supply Voltage-Nom |
1.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
COMMERCIAL
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Width |
17 mm
|
|
uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR
|
MICROPROCESSOR, RISC
|
Base Number Matches |
1
|
2
|
Additional Feature |
|
SUPPORTS MULTICHANNEL HDLC AND ATM
|
|
|
|
Compare LUPXA255A0C400 with alternatives
Compare MPC850SRZT50A with alternatives