M2732AF6 vs AM2732BDC feature comparison

M2732AF6 STMicroelectronics

Buy Now Datasheet

AM2732BDC Rochester Electronics LLC

Buy Now Datasheet
Rohs Code No
Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer STMICROELECTRONICS ROCHESTER ELECTRONICS LLC
Part Package Code DIP
Package Description WINDOWED, FRIT SEALED, CERAMIC, DIP-24 DIP,
Pin Count 24
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.61
Access Time-Max 250 ns 250 ns
Additional Feature 21V PROGRAMMING VOLTAGE
I/O Type COMMON
JESD-30 Code R-GDIP-T24 R-GDIP-T24
JESD-609 Code e0
Length 31.75 mm 32.0675 mm
Memory Density 32768 bit 32768 bit
Memory IC Type UVPROM UVPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 4KX8 4KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP24,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 21 V
Qualification Status Not Qualified
Seated Height-Max 5.715 mm 5.588 mm
Supply Current-Max 0.125 mA 0.1 mA
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology NMOS NMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 1 2

Compare M2732AF6 with alternatives