M2GL005S-1VF400
vs
M2GL005S-1VFG400I
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
LFBGA, BGA400,20X20,32
|
17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-400
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
S-PBGA-B400
|
S-PBGA-B400
|
| Length |
17 mm
|
17 mm
|
| Number of Inputs |
171
|
171
|
| Number of Logic Cells |
6060
|
6060
|
| Number of Outputs |
171
|
171
|
| Number of Terminals |
400
|
400
|
| Operating Temperature-Max |
85 °C
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
LFBGA
|
| Package Equivalence Code |
BGA400,20X20,32
|
BGA400,20X20,32
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.51 mm
|
1.51 mm
|
| Supply Voltage-Max |
1.26 V
|
1.26 V
|
| Supply Voltage-Min |
1.14 V
|
1.14 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Width |
17 mm
|
17 mm
|
| Base Number Matches |
2
|
2
|
| Factory Lead Time |
|
8 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
| Moisture Sensitivity Level |
|
3
|
| Packing Method |
|
TRAY
|
|
|
|
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