M30622SGP
vs
M30620FCAGP
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MITSUBISHI ELECTRIC CORP
|
RENESAS TECHNOLOGY CORP
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
LFQFP, QFP100,.63SQ,20
|
LFQFP, QFP100,.63SQ,20
|
| Pin Count |
100
|
100
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Additional Feature |
OPERATES AT 2.7V MIN SUPPLY @ 10MHZ
|
ALSO OPERATES AT 2.7V MINIMUM SUPPLY
|
| Address Bus Width |
20
|
20
|
| Bit Size |
16
|
16
|
| CPU Family |
M16C
|
M16C
|
| Clock Frequency-Max |
16 MHz
|
16 MHz
|
| DAC Channels |
YES
|
YES
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
16
|
16
|
| JESD-30 Code |
S-PQFP-G100
|
S-PQFP-G100
|
| JESD-609 Code |
e0
|
e2
|
| Length |
14 mm
|
14 mm
|
| Number of I/O Lines |
88
|
88
|
| Number of Terminals |
100
|
100
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-20 °C
|
-20 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFQFP
|
LFQFP
|
| Package Equivalence Code |
QFP100,.63SQ,20
|
QFP100,.63SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
3072
|
10240
|
| Seated Height-Max |
1.7 mm
|
1.7 mm
|
| Speed |
16 MHz
|
16 MHz
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
4.2 V
|
5 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Copper (Sn/Cu)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
14 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
5
|
| Pbfree Code |
|
Yes
|
| Moisture Sensitivity Level |
|
3
|
| On Chip Program ROM Width |
|
8
|
| Peak Reflow Temperature (Cel) |
|
260
|
| ROM (words) |
|
131072
|
| ROM Programmability |
|
FLASH
|
| Supply Current-Max |
|
50 mA
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare M30622SGP with alternatives
Compare M30620FCAGP with alternatives