M30622SPGP vs M30626FHPGP-D9 feature comparison

M30622SPGP Renesas Electronics Corporation

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M30626FHPGP-D9 Renesas Electronics Corporation

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Not Recommended Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP RENESAS TECHNOLOGY CORP
Part Package Code QFP QFP
Package Description 14 X 14 MM, 0.50 MM PITCH, PLASTIC, LQFP-100 LFQFP,
Pin Count 100 100
Reach Compliance Code compliant unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC YES YES
Additional Feature ALSO OPERATES AT 2.7V MINIMUM SUPPLY AT 10 MHZ OPERATES AT 2.7 V MINIMUM SUPPLY @ 10 MHZ
Address Bus Width 20 20
Bit Size 16 16
CPU Family M16C
Clock Frequency-Max 16 MHz 16 MHz
DAC Channels YES YES
DMA Channels YES YES
External Data Bus Width 16 16
JESD-30 Code S-PQFP-G100 S-PQFP-G100
JESD-609 Code e2 e0
Length 14 mm 14 mm
Moisture Sensitivity Level 4
Number of I/O Lines 88 88
Number of Terminals 100 100
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -20 °C -20 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP LFQFP
Package Equivalence Code QFP100,.63SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 4096
Seated Height-Max 1.7 mm 1.7 mm
Speed 24 MHz 24 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN COPPER TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 20
Width 14 mm 14 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 7 2
Boundary Scan NO
On Chip Program ROM Width 8
ROM (words) 397312
ROM Programmability FLASH

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