M3062LFGPFP
vs
M30800SAGP
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Not Recommended
|
Transferred
|
| Ihs Manufacturer |
RENESAS TECHNOLOGY CORP
|
MITSUBISHI ELECTRIC CORP
|
| Part Package Code |
QFP
|
|
| Package Description |
14 X 20 MM, 0.65 MM PITCH, PLASTIC, QFP-100
|
,
|
| Pin Count |
100
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
|
| Additional Feature |
ALSO OPERATES AT 2.7V MINIMUM SUPPLY AT 10 MHZ
|
|
| Address Bus Width |
20
|
|
| Bit Size |
16
|
|
| CPU Family |
M16C
|
|
| Clock Frequency-Max |
16 MHz
|
|
| DAC Channels |
YES
|
|
| DMA Channels |
YES
|
|
| External Data Bus Width |
16
|
|
| JESD-30 Code |
R-PQFP-G100
|
|
| JESD-609 Code |
e0
|
|
| Length |
20 mm
|
|
| Number of I/O Lines |
88
|
|
| Number of Terminals |
100
|
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-20 °C
|
|
| PWM Channels |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
QFP
|
|
| Package Equivalence Code |
QFP100,.7X.9
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
FLATPACK
|
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Qualification Status |
Not Qualified
|
|
| RAM (bytes) |
20480
|
|
| ROM (words) |
262144
|
|
| ROM Programmability |
FLASH
|
|
| Seated Height-Max |
3.05 mm
|
|
| Speed |
24 MHz
|
|
| Supply Current-Max |
27 mA
|
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
5 V
|
|
| Supply Voltage-Nom |
5 V
|
|
| Surface Mount |
YES
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
QUAD
|
|
| Width |
14 mm
|
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare M3062LFGPFP with alternatives