M36L0R7060T1ZAQF vs M36W0R6040T0ZAQF feature comparison

M36L0R7060T1ZAQF STMicroelectronics

Buy Now Datasheet

M36W0R6040T0ZAQF STMicroelectronics

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer STMICROELECTRONICS STMICROELECTRONICS
Part Package Code BGA BGA
Package Description 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-88 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88
Pin Count 88 88
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature PSRAM IS ORGANIZED AS 4M X 16 PSRAM IS ORGANIZED AS 1M X 16
JESD-30 Code R-PBGA-B88 R-PBGA-B88
Length 10 mm 10 mm
Memory Density 134217728 bit 67108864 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 88 88
Number of Words 8388608 words 4194304 words
Number of Words Code 8000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -30 °C
Organization 8MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL EXTENDED OTHER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 8 mm 8 mm
Base Number Matches 1 1
Access Time-Max 70 ns
JESD-609 Code e1
Mixed Memory Type FLASH+PSRAM
Package Equivalence Code BGA88,8X12,32
Standby Current-Max 0.00011 A
Supply Current-Max 0.045 mA
Terminal Finish TIN SILVER COPPER

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