M36L0R7060T1ZAQF vs MT28C256532W18SBT-F705P70BBWT feature comparison

M36L0R7060T1ZAQF STMicroelectronics

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MT28C256532W18SBT-F705P70BBWT Micron Technology Inc

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer STMICROELECTRONICS MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description 8 X 10 MM, 0.80 MM PITCH, ROHS COMPLIANT, TFBGA-88 LFBGA,
Pin Count 88 88
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature PSRAM IS ORGANIZED AS 4M X 16 CELLULARRAM IS ORGANIZED AS 2M X 16; CONTAINS ADDITIONAL 8M X 16 FLASH
JESD-30 Code R-PBGA-B88 R-PBGA-B88
Length 10 mm 12 mm
Memory Density 134217728 bit 134217728 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 88 88
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 8MX16 8MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.4 mm
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL EXTENDED OTHER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 8 mm 9 mm
Base Number Matches 1 1
JESD-609 Code e1
Terminal Finish TIN SILVER COPPER

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Compare MT28C256532W18SBT-F705P70BBWT with alternatives