M36LLR8760M1ZAQT vs M36W0R6040T0ZAQF feature comparison

M36LLR8760M1ZAQT STMicroelectronics

Buy Now Datasheet

M36W0R6040T0ZAQF STMicroelectronics

Buy Now Datasheet
Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer STMICROELECTRONICS STMICROELECTRONICS
Part Package Code BGA BGA
Package Description 8 X 10 MM, 0.80 MM PITCH, LFBGA-88 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88
Pin Count 88 88
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature PSEUDO SRAM IS ORGANIZED AS 4M X 16; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE PSRAM IS ORGANIZED AS 1M X 16
JESD-30 Code R-PBGA-B88 R-PBGA-B88
JESD-609 Code e0 e1
Length 10 mm 10 mm
Memory Density 268435456 bit 67108864 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+PSRAM FLASH+PSRAM
Number of Functions 1 1
Number of Terminals 88 88
Number of Words 16777216 words 4194304 words
Number of Words Code 16000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -30 °C
Organization 16MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA TFBGA
Package Equivalence Code BGA88,8X12,32 BGA88,8X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.2 mm
Standby Current-Max 0.00011 A 0.00011 A
Supply Current-Max 0.052 mA 0.045 mA
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 1 1
Access Time-Max 70 ns

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