M36P0R9070E0ZACE vs PF38F4050M0Y0C0 feature comparison

M36P0R9070E0ZACE STMicroelectronics

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PF38F4050M0Y0C0 Intel Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer STMICROELECTRONICS INTEL CORP
Part Package Code BGA BGA
Package Description 8 X 11 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-107 TFBGA, BGA107,9X12,32
Pin Count 107 107
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 70 ns
Additional Feature PSRAM IS ORGANISED AS 8M X 16BIT PSEUDO SRAM IS ORGANIZED AS 4M X 16
JESD-30 Code R-PBGA-B107 R-PBGA-B107
Length 11 mm 11 mm
Memory Density 536870912 bit 268435456 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+PSRAM FLASH+PSRAM
Number of Functions 1 1
Number of Terminals 107 107
Number of Words 33554432 words 16777216 words
Number of Words Code 32000000 16000000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -30 °C -30 °C
Organization 32MX16 16MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA107,9X12,32 BGA107,9X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 1.95 V 2 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL EXTENDED OTHER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Width 8 mm 8 mm
Base Number Matches 3 2
JESD-609 Code e1
Moisture Sensitivity Level 3
Standby Current-Max 0.00012 A
Terminal Finish TIN SILVER COPPER

Compare M36P0R9070E0ZACE with alternatives

Compare PF38F4050M0Y0C0 with alternatives