M36P0R9070E0ZACF vs PF38F5566MMY0C0 feature comparison

M36P0R9070E0ZACF Micron Technology Inc

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PF38F5566MMY0C0 Intel Corporation

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICRON TECHNOLOGY INC INTEL CORP
Part Package Code BGA BGA
Package Description TFBGA, BGA107,9X12,32 LFBGA, BGA107,9X12,32
Pin Count 107 107
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 96 ns
Additional Feature SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; PSRAM IS ORGANISED AS 8M X 16 PSEUDO SRAM IS ORGANIZED AS 16M X 16
JESD-30 Code R-PBGA-B107 R-PBGA-B107
JESD-609 Code e1 e1
Length 11 mm 11 mm
Memory Density 536870912 bit 1073741824 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+PSRAM FLASH+PSRAM
Number of Functions 1 1
Number of Terminals 107 107
Number of Words 33554432 words 67108864 words
Number of Words Code 32000000 64000000
Operating Mode ASYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -30 °C -30 °C
Organization 32MX16 64MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA LFBGA
Package Equivalence Code BGA107,9X12,32 BGA107,9X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.4 mm
Standby Current-Max 0.0002 A 0.00012 A
Supply Voltage-Max (Vsup) 1.95 V 2 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 3 2
Moisture Sensitivity Level 3

Compare M36P0R9070E0ZACF with alternatives

Compare PF38F5566MMY0C0 with alternatives