M36W432BG70ZA6 vs AT52BR3248T-90CI feature comparison

M36W432BG70ZA6 STMicroelectronics

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AT52BR3248T-90CI Microchip Technology Inc

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS MICROCHIP TECHNOLOGY INC
Part Package Code BGA
Package Description 12 X 8 MM, 0.80 MM PITCH, LFBGA-66 11 X 8 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, PLASTIC, CHIP SCALE, BGA-66
Pin Count 66
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 70 ns 90 ns
Additional Feature STATIC RAM ORGANISED AS 256K X 16 SRAM IS ORGANISED AS 512K X 16
JESD-30 Code R-PBGA-B66 R-PBGA-B66
JESD-609 Code e0 e0
Length 12 mm 11 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Mixed Memory Type FLASH+SRAM FLASH+SRAM
Number of Functions 1 1
Number of Terminals 66 66
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA TFBGA
Package Equivalence Code BGA66,8X12,32 BGA66,8X12,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.2 mm
Standby Current-Max 0.00001 A 0.000002 A
Supply Current-Max 0.02 mA 0.04 mA
Supply Voltage-Max (Vsup) 3.3 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 2 1

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