M37212EFFP
vs
M37212EFFP
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MITSUBISHI ELECTRIC CORP
|
RENESAS ELECTRONICS CORP
|
Part Package Code |
QFP
|
QFP
|
Package Description |
QFP, QFP80,.7X.9,32
|
14 X 20 MM, 0.80 MM PITCH, PLASTIC, QFP-80
|
Pin Count |
80
|
80
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
|
|
Bit Size |
8
|
8
|
CPU Family |
MELPS740
|
|
Clock Frequency-Max |
8.1 MHz
|
8.1 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
|
|
JESD-30 Code |
R-PQFP-G80
|
R-PQFP-G80
|
JESD-609 Code |
e0
|
|
Length |
20 mm
|
20 mm
|
Number of I/O Lines |
43
|
43
|
Number of Terminals |
80
|
80
|
On Chip Program ROM Width |
8
|
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
-10 °C
|
-10 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
QFP
|
Package Equivalence Code |
QFP80,.7X.9,32
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLATPACK
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
1216
|
|
ROM (words) |
63488
|
|
ROM Programmability |
OTPROM
|
OTPROM
|
Seated Height-Max |
3.05 mm
|
3.05 mm
|
Speed |
4 MHz
|
8.1 MHz
|
Supply Current-Max |
60 mA
|
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
14 mm
|
14 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
1
|
|
|
|