M37510E6FP
vs
M38223M4DXXXFP
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MITSUBISHI ELECTRIC CORP
|
MITSUBISHI ELECTRIC CORP
|
Part Package Code |
QFP
|
QFP
|
Package Description |
LFQFP, QFP176,1.0SQ,20
|
QFP, QFP80,.7X.9,32
|
Pin Count |
176
|
80
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
NO
|
YES
|
Additional Feature |
LCD DRIVER/CONTROLLER
|
|
Address Bus Width |
|
|
Bit Size |
8
|
8
|
CPU Family |
MELPS740
|
MELPS740
|
Clock Frequency-Max |
8 MHz
|
8 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PQFP-G176
|
R-PQFP-G80
|
JESD-609 Code |
e0
|
e0
|
Length |
24 mm
|
20 mm
|
Number of I/O Lines |
41
|
54
|
Number of Terminals |
176
|
80
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-20 °C
|
-40 °C
|
PWM Channels |
NO
|
NO
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFQFP
|
QFP
|
Package Equivalence Code |
QFP176,1.0SQ,20
|
QFP80,.7X.9,32
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
512
|
512
|
ROM (words) |
24576
|
16384
|
ROM Programmability |
OTPROM
|
MROM
|
Seated Height-Max |
1.7 mm
|
3.05 mm
|
Speed |
4 MHz
|
8 MHz
|
Supply Current-Max |
13 mA
|
13 mA
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
5 V
|
4 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
24 mm
|
14 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
2
|
2
|
|
|
|
Compare M37510E6FP with alternatives
Compare M38223M4DXXXFP with alternatives